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HP-450ZK Online Pre Potting Vacuum Extraction Machine For Power Electronics

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HP-450ZK Online Pre Potting Vacuum Extraction Machine For Power Electronics

Electric Rail Width Adjustment : 200-500mm electrically adjustable for quick changeover

Delivery Time : 30 working days

High Component Clearance : ±110mm upper and lower component height capacity

Brand Name : Haipai

SMEMA Integration : Standard interface for seamless line communication

Wide Pressure Range : -0.12 to 0.6MPa for both vacuum extraction and positive pressure applications

Pneumatic Lifting : Reliable chamber sealing mechanism

Certification : CE,ISO9001

Packaging Details : Wooden case with vacuum package inside

MOQ : 1 unit

Inline Vacuum Processing : Integrates directly into automated SMT or dispensing lines for continuous production

Payment Terms : T/T

Dual Stepper Motor Conveyor : Fast and precise board transport with independent control

Model Number : HP-450ZK

Place of Origin : China

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HP-450ZK Online Vacuum Extraction Machine

The HP-450ZK Online Vacuum Extraction Machine is a compact inline system designed to remove trapped air and voids from potted electronic assemblies or to create vacuum conditions prior to potting operations. Integrated directly into automated SMT or dispensing lines, this machine provides continuous in-line vacuum processing without the need for batch loading or manual handling.

The chamber internal dimensions of 500mm * 500mm * 200mm accommodate a wide variety of PCB sizes and component heights. The chain conveyor system, driven by dual stepper motors with independent control, ensures fast and precise board transport. Rail width is electrically adjustable from 200-500mm, allowing quick changeover between different board sizes without manual intervention. PCB transmission height is set at 910±20mm for compatibility with standard SMT line heights.

Component height clearance of up to ±110mm on both upper and lower sides accommodates tall components and assemblies with components on both board surfaces. The pneumatic lifting mechanism raises and lowers the chamber or conveyor section to seal the vacuum environment. In-place blocking positioning ensures accurate board location within the chamber before each vacuum cycle.

The system achieves pressure values from -0.12 to 0.6MPa, providing both vacuum extraction and positive pressure capabilities. Control is handled by a PLC with display screen interface for simple operation and real-time monitoring. The steel structure features welded construction with high-temperature paint baking for durability in production environments. The SMEMA interface enables seamless integration into automated SMT lines for fully inline operation.


Technical Specifications
Parameter Specification
Model HP-450ZK
Machine Dimensions L800*W800*H2200mm (including protrusion)
Weight Approx. 500KG
Control Method PLC + Display Screen Control
Mechanical Structure Steel structure welding, high-temperature paint baking
PCB Transmission Height 910±20mm
Chamber Internal Dimensions (Effective) 500mm (L) * 500mm (W) * 200mm (H)
Conveyor Type Chain conveyor
Transmission Motor Dual stepper motor independent control, fast and precise
Rail Width 200-500mm (electric adjustable)
Component Height Upper and lower MAX: ±110mm
Lifting Mode Pneumatic
Positioning Method In-place blocking positioning
Pressure Value -0.12 to 0.6MPa
Power Supply (including vacuum pump) AC220V 50Hz, 500W / AC380V 50Hz
Equipment Air Pressure 0.4-0.6MPa
Interface SMEMA

Key Features
  • Inline Vacuum Processing: Integrates directly into automated SMT or dispensing lines for continuous production
  • Generous Chamber Size: 500*500*200mm internal dimensions accommodate diverse PCB sizes
  • Electric Rail Width Adjustment: 200-500mm electrically adjustable for quick changeover
  • High Component Clearance: ±110mm upper and lower component height capacity
  • Dual Stepper Motor Conveyor: Fast and precise board transport with independent control
  • Pneumatic Lifting: Reliable chamber sealing mechanism
  • Wide Pressure Range: -0.12 to 0.6MPa for both vacuum extraction and positive pressure applications
  • PLC Control: Simple operation with display screen interface
  • Durable Construction: Steel structure welding with high-temperature paint baking
  • SMEMA Integration: Standard interface for seamless line communication
  • Standard SMT Height: 910±20mm PCB transmission height for line compatibility

Applications
  • Vacuum extraction before potting/encapsulation
  • Bubble removal from potted electronic assemblies
  • Void reduction in epoxy, silicone, and polyurethane potting
  • Pre-potting vacuum treatment for power electronics
  • Automotive electronics vacuum processing
  • Medical device encapsulation preparation
  • LED module vacuum treatment
  • Transformer and coil vacuum impregnation preparation
  • Any inline application requiring vacuum conditions prior to fluid dispensing


Industry Keywords Tag Cloud :

 

Core Equipment Terms: Glue Potting Machine, Automatic Potting System, Two-Component Potting Equipment, Vacuum Potting Machine, Meter Mix Dispense System, Inline Potting Production Line, Dual-Component Dispensing System, Heavy-Duty Potting Machine, Resin Dispensing System


Processing & Technology Keywords: Fluid Potting Process, Deep Section Resin Filling, Two-Part Metering Mixing, Dynamic Fluid Mixing, Static Mixing Technology, Variable Ratio Dispensing, Bubble-Free Potting, Continuous Liquid Feeding, Volumetric Piston Pump Metering, Gear Pump Fluid Dispensing


Material Compatibility Keywords: Two-Component Epoxy Resin, Polyurethane Potting Compound, Two-Part Silicone Elastomer, Thermal Conductive Potting Resin, Polyurethane Foam Gasketing, Flame Retardant Protective Resin, Low Viscosity Liquid Polyurethane, A and B Component Resin


Manufacturing & Application Keywords: Power Supply Protection, Battery Management System Protection, BMS Potting, Automotive Electronics Potting, Ignition Coil Sealing, Transformer Potting, Capacitor Protective Sealing, LED Driver Waterproof Sealing, Industrial Automation Module Insulation, Renewable Energy Electronics Protection


Performance & Inspection Keywords: Precision Mixing Ratio Control, Continuous Uniform Flow, Anti-Drip Dispensing Valve, Automated Fluid Temperature Regulation, Material Tank Agitation System, Vacuum Degassing Technology, Automatic Weight Calibration, Multi-Axis Motion Potting Path, Industrial IoT Monitoring

 

Quality & Curing Keywords: Potting Volume Quality Control, Resin Level Detection, Curing Process Management, Thermal Curing Tunnel Oven, Infrared Rapid Curing, Defect-Free Potting Verification, Quality Assurance Tracking, Process Validation, Turnkey Potting Line Solution


Product Tags:

Online Vacuum Extraction Machine

      

Pre Potting Vacuum Extraction Machine

      

Power Electronics Vacuum Extraction Machine

      
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